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公开(公告)号：US20210018449A1
公开(公告)日：2021-01-21
申请号：US17062231
申请日：2020-10-02
Applicant: Applied Materials, Inc.
Inventor： Todd EGAN , Mehdi VAEZ-IRAVANI , Samer BANNA , Kyle TANTIWONG , Gregory KIRK , Abraham RAVID , Yaoming SHEN
Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.
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2.发明公开公开(公告)号：US20240363446A1
公开(公告)日：2024-10-31
申请号：US18141306
申请日：2023-04-28
Applicant: Applied Materials, Inc.
Inventor： Venkatakaushik VOLETI , Kyle TANTIWONG , Mehdi VAEZ-IRAVANI
CPC classification number: H01L22/12 , H01L21/67144 , H01L21/67288 , H01L24/80 , H01L2224/8001 , H01L2224/80895 , H01L2224/80896 , H01L2224/80908
Abstract: Methods and apparatus of hybrid bonding with inspection are provided herein. In some embodiments, a method of hybrid bonding with inspection includes: cleaning a substrate via a first cleaning chamber and a tape frame having a plurality of chiplets via a second cleaning chamber; inspecting, via a first metrology system, the substrate for pre-bond defects in a first metrology chamber and the tape frame for pre-bond defects in a second metrology chamber; bonding one or more of the plurality of chiplets to the substrate via a hybrid bonding process in a bonder chamber to form a bonded substrate; and performing, via a second metrology system different than the first metrology system, a post-bond inspection of the bonded substrate via a third metrology chamber for post-bond defects.
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公开(公告)号：US20150181684A1
公开(公告)日：2015-06-25
申请号：US14543316
申请日：2014-11-17
Applicant: Applied Materials, Inc.
Inventor： Samer BANNA , Vladimir KNYAZIK , Kyle TANTIWONG
IPC: H05H1/24 , H01L21/67 , H01L21/3065
CPC classification number: H05H1/24 , H01J37/321 , H01J37/32174 , H01J37/32642 , H01J37/32697 , H01L21/6875
Abstract: Embodiments of the present disclosure provide apparatus and methods for improving plasma uniformity around edge regions and/or reducing non-symmetry in a plasma processing chamber. One embodiment of the present disclosure provides a plasma tuning assembly having one or more conductive bodies disposed around an edge region of a substrate support in a plasma processing chamber. The one or more conductive bodies are isolated from other chamber components and electrically floating in the processing chamber near the edge region without connecting to active electrical potentials. During operation, when a plasma is maintained in the plasma processing chamber, the presence of the one or more conductive bodies affects the plasma distribution near the one or more conductive bodies.
Abstract translation: 本公开的实施例提供了用于改善边缘区域周围的等离子体均匀性和/或降低等离子体处理室中的非对称性的装置和方法。 本公开的一个实施例提供了等离子体调谐组件，其具有设置在等离子体处理室中的衬底支撑件的边缘区域周围的一个或多个导电体。 一个或多个导电体与其它腔室部件隔离，并且在边缘区域附近电处理室中浮动，而不会连接到有源电位。 在操作期间，当在等离子体处理室中维持等离子体时，一个或多个导电体的存在影响一个或多个导电体附近的等离子体分布。
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公开(公告)号：US20170110292A1
公开(公告)日：2017-04-20
申请号：US15393828
申请日：2016-12-29
Applicant: Applied Materials, Inc.
Inventor： Vladimir KNYAZIK , Kyle TANTIWONG , Samer BANNA , Waheb BISHARA
IPC: H01J37/32
CPC classification number: H01J37/32449 , F26B21/004 , H01J37/3244
Abstract: An apparatus for providing processing gases to a process chamber with improved uniformity is disclosed. One embodiment provides a gas delivery assembly. The gas delivery assembly includes a hub, a nozzle, and one or more gas diffusers disposed in the nozzle. The nozzle has a cylindrical body with a side wall and a top surface. A plurality of injection passages are formed inside the nozzle to deliver processing gases into the process chamber via a plurality of outlets disposed in the side wall. The injection passages are configured to direct process gases out of each outlet disposed in the side wall in a direction which is not radially aligned with a centerline of the hub.
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公开(公告)号：US20150364354A1
公开(公告)日：2015-12-17
申请号：US14762796
申请日：2014-03-10
Applicant: APPLIED MATERIALS, INC.
Inventor： Kyle TANTIWONG , Vladimir KNYAZIK , Samer BANNA
IPC: H01L21/683 , H01J37/32
CPC classification number: H01L21/6833 , H01J37/3244 , H01L21/67109 , H01L21/67248 , H01L21/6831 , Y10T279/23
Abstract: An electrostatic chuck (ESC) with a cooling base for plasma processing chambers, such as a plasma etch chamber. In embodiments, a plasma processing chuck includes a plurality of independent edge zones. In embodiments, the edge zones are segments spanning different azimuth angles of the chuck to permit independent edge temperature tuning, which may be used to compensate for other chamber related non-uniformities or incoming wafer non-uniformities. In embodiments, the chuck includes a center zone having a first heat transfer fluid supply and control loop, and a plurality of edge zones, together covering the remainder of the chuck area, and each having separate heat transfer fluid supply and control loops. In embodiments, the base includes a diffuser, which may have hundreds of small holes over the chuck area to provide a uniform distribution of heat transfer fluid.
Abstract translation: 具有用于等离子体处理室的冷却基座的静电卡盘（ESC），例如等离子体蚀刻室。 在实施例中，等离子体处理卡盘包括多个独立的边缘区域。 在实施例中，边缘区域是跨越卡盘的不同方位角的区段，以允许独立的边缘温度调节，其可以用于补偿其它室相关的不均匀性或进入的晶片非均匀性。 在实施例中，卡盘包括具有第一传热流体供应和控制回路以及多个边缘区域的中心区域，其一起覆盖卡盘区域的其余部分，并且每个具有单独的传热流体供应和控制回路。 在实施例中，底座包括扩散器，其可以在卡盘区域上方具有数百个小孔以提供传热流体的均匀分布。
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Patent Agency Ranking
公开(公告)号：US20140209596A1
公开(公告)日：2014-07-31
申请号：US14162510
申请日：2014-01-23
Applicant: Applied Materials, Inc.
Inventor： Dmitry LUBOMIRSKY , Kyle TANTIWONG , Samer BANNA
IPC: H01L21/02
CPC classification number: H01L21/6831 , H01L21/67 , H01L21/67098
Abstract: Embodiments of the present disclosure generally provide apparatus and method for cooling a substrate support in a uniform manner. One embodiment of the present disclosure provides a cooling assembly for a substrate support. The cooling assembly includes a cooling base having a first side for contacting the substrate support and providing cooling to the substrate support, a diffuser disposed on a second side of the cooling base, wherein the diffuser defines a plurality of cooling paths for delivering a cooling fluid towards the cooling base in a parallel manner, and an inlet/outlet plate disposed under the diffuser, wherein the inlet/outlet plate is provides an interface between the diffuser and an inlet and outlet of a cooling fluid.
Abstract translation: 本公开的实施例通常提供用于以均匀方式冷却衬底支撑件的装置和方法。 本公开的一个实施例提供了一种用于衬底支撑件的冷却组件。 所述冷却组件包括冷却基座，所述冷却基座具有用于接触所述基板支撑件并且向所述基板支撑件提供冷却的第一侧，设置在所述冷却基座的第二侧上的扩散器，其中所述扩散器限定多个用于输送冷却流体的冷却路径 以平行方式朝向冷却基座，以及设置在扩散器下方的入口/出口板，其中入口/出口板提供扩散器与冷却流体的入口和出口之间的界面。
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公开(公告)号：US20190072497A1
公开(公告)日：2019-03-07
申请号：US16080075
申请日：2017-05-23
Applicant: Applied Materials, Inc.
Inventor： Todd EGAN , Mehdi VAEZ-IRAVANI , Samer BANNA , Kyle TANTIWONG , Gregory KIRK , Abraham RAVID , Yaoming SHEN
Abstract: A system for processing a substrate is provided. The system includes a process chamber including one or more sidewalls enclosing a processing region; and a substrate support. The system further includes a passageway connected to the process chamber; and a first particle detector disposed at a first location along the passageway. The first particle detector includes an energy source configured to emit a first beam; one or more optical devices configured to direct the first beam along one or more paths, where the one or more paths extend through at least a portion of the passageway. The first particle detector further includes a first energy detector disposed at a location other than on the one or more paths. The system further includes a controller configured to communicate with the first particle detector, wherein the controller is configured to identify a fault based on signals received from the first particle detector.
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公开(公告)号：US20190057910A1
公开(公告)日：2019-02-21
申请号：US16080102
申请日：2017-03-09
Applicant: Applied Materials, Inc.
Inventor： Mehdi VAEZ-IRAVANI , Todd EGAN , Samer BANNA , Kyle TANTIWONG
Abstract: Embodiments of the disclosure provide a metrology system. In one example, a metrology system includes a laser source adapted to transmit a light beam, a lens adapted to receive at least a portion of the light beam from the laser source, a first beam splitter positioned to receive at least the portion of the light beam passing through the lens, a first beam displacing device adapted to cause a portion of the light beam received from the beam splitter to be split into two or more sub-light beams a first recording device having a detection surface, and a first polarizer that is positioned between the first displacing device and the first recording device, wherein the first polarizer is configured to cause the two or more sub-light beams provided from the first displacing device to form an interference pattern on the detection surface of the first recording device.
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9.发明申请公开(公告)号：US20140237840A1
公开(公告)日：2014-08-28
申请号：US13959801
申请日：2013-08-06
Applicant: Applied Materials, Inc.
Inventor： Vladimir KNYAZIK , Kyle TANTIWONG , Samer BANNA , Waheb BISHARA
CPC classification number: H01J37/32449 , F26B21/004 , H01J37/3244
Abstract: Embodiments of the present invention relate to an apparatus for providing processing gases to a process chamber with improved uniformity. One embodiment of the present invention provides a gas delivery assembly. The gas delivery assembly includes a hub, a nozzle, and one or more gas diffusers disposed in the nozzle. The nozzle has a cylindrical body with a side wall and a top surface. A plurality of injection passages are formed inside the nozzle to deliver processing gases into the process chamber via a plurality of outlets disposed in the side wall. The injection passages are configured to direct process gases out of each outlet disposed in the side wall in a direction which is not radially aligned with a centerline of the hub.
Abstract translation: 本发明的实施例涉及一种用于向处理室提供具有改进的均匀性的处理气体的装置。 本发明的一个实施例提供一种气体输送组件。 气体输送组件包括轮毂，喷嘴和设置在喷嘴中的一个或多个气体扩散器。 喷嘴具有带有侧壁和顶面的圆柱体。 在喷嘴内部形成多个喷射通道，通过设置在侧壁中的多个出口将处理气体输送到处理室中。 喷射通道构造成将处理气体从布置在侧壁中的每个出口沿着不与轮毂的中心线径向对准的方向引导。
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公开(公告)号：US20190074201A1
公开(公告)日：2019-03-07
申请号：US16079961
申请日：2017-03-30
Applicant: Applied Materials, Inc.
Inventor： Mehdi VAEZ-IRAVANI , Todd EGAN , Samer BANNA , Kyle TANTIWONG
Abstract: Embodiments of the disclosure provide methods and system for inspecting and treating a substrate. In one embodiment, a method is provided including transmitting a first plurality of beams from a diffractive beam splitter to a first surface of a substrate to generate a reflection of a second plurality of beams, wherein the first plurality of beams are spaced apart from each other upon arriving at the first surface of the substrate; receiving the second plurality of beams on a recording surface of an optical device, wherein the second plurality of beams are spaced apart from each other upon arriving at the recording surface; measuring positional information of the second plurality of beams on the recording surface; comparing the positional information of the second plurality of beams to positional information stored in a memory; and storing a result of the comparison in the memory.
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