发明申请
- 专利标题： WAFER POLISHING APPARATUS AND METHOD
- 专利标题（中）： 抛光抛光装置和方法
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申请号： US14167898申请日： 2014-01-29
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公开(公告)号： US20140213155A1公开(公告)日： 2014-07-31
- 发明人: Tetsuji TOGAWA , Atsushi YOSHIDA , Toshifumi WATANABE
- 申请人： EBARA CORPORATION
- 优先权： JP2013-015937 20130130
- 主分类号： B24B9/06
- IPC分类号： B24B9/06 ; B24B21/00 ; H01L21/463
摘要：
An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.
公开/授权文献
- US09399274B2 Wafer polishing method 公开/授权日：2016-07-26
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