发明申请
- 专利标题： CONDUCTIVE MICRO-WIRE STRUCTURE WITH OFFSET INTERSECTIONS
- 专利标题（中）： 导电微结构与偏移相互作用
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申请号： US13759106申请日： 2013-02-05
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公开(公告)号： US20140216790A1公开(公告)日： 2014-08-07
- 发明人: David P. Trauernicht , John A. Lebens , Yongcai Wang
- 申请人： David P. Trauernicht , John A. Lebens , Yongcai Wang
- 主分类号： H05K1/02
- IPC分类号： H05K1/02
摘要：
A conductive micro-wire structure includes a substrate and a plurality of micro-wires formed on or in the substrate in an intersecting pattern and forming intersection corners. A portion of a first micro-wire is coincident with a portion of a second micro-wire to form a coincident portion such that the coincident portion is non-visually resolvable by the human visual system and the coincident portion has a length greater than the sum of the widths of the first and second micro-wires or has one or more rounded intersection corners.
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