Invention Application
US20140217193A1 METHOD AND APPARATUS FOR PURGING AND PLASMA SUPPRESSION IN A PROCESS CHAMBER
有权
方法和装置在过程室中的冲洗和等离子体抑制
- Patent Title: METHOD AND APPARATUS FOR PURGING AND PLASMA SUPPRESSION IN A PROCESS CHAMBER
- Patent Title (中): 方法和装置在过程室中的冲洗和等离子体抑制
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Application No.: US13760686Application Date: 2013-02-06
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Publication No.: US20140217193A1Publication Date: 2014-08-07
- Inventor: Patrick Breiling , Kevin Gerber , Jennifer O'Loughlin , Nagraj Shankar , Pramod Subramonium
- Applicant: NOVELLUS SYSTEMS, INC.
- Applicant Address: US CA San Jose
- Assignee: Novellus Systems, Inc.
- Current Assignee: Novellus Systems, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: B05B1/00
- IPC: B05B1/00
Abstract:
A substrate processing system includes a showerhead that comprises a head portion and a stem portion and that delivers precursor gas to a processing chamber. A baffle includes a base portion having an outer diameter that is greater than an outer diameter of the head portion of the showerhead, that comprises a dielectric material and that is arranged between the head portion of the showerhead and an upper surface of the processing chamber.
Public/Granted literature
- US09399228B2 Method and apparatus for purging and plasma suppression in a process chamber Public/Granted day:2016-07-26
Information query
