发明申请
- 专利标题： Catalyst Assembly Including an Intermetallic Compound of Iridium And Tungsten
- 专利标题（中）： 催化剂装配包括铱和钨的金属间化合物
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申请号： US13756621申请日： 2013-02-01
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公开(公告)号： US20140220475A1公开(公告)日： 2014-08-07
- 发明人: Patrick Pietrasz , Jun Yang , Mark S. Sulek
- 申请人： FORD GLOBAL TECHNOLOGIES, LLC
- 申请人地址： US MI Dearborn
- 专利权人： FORD GLOBAL TECHNOLOGIES, LLC
- 当前专利权人： FORD GLOBAL TECHNOLOGIES, LLC
- 当前专利权人地址： US MI Dearborn
- 主分类号： H01M4/90
- IPC分类号： H01M4/90 ; H01M4/86 ; B01J23/652
摘要：
A catalyst assembly having a substrate including an intermetallic compound of W and Ir. The weight ratio of W to Ir is in a range between a first ratio and a second ratio. A catalyst includes at least one noble metal is supported on and contacts the substrate. The first ratio may be in the range of 48:52 and the second ratio may be in the range of 51:49.
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