发明申请
- 专利标题： CHIP PACKAGE FOR HIGH-COUNT CHIP STACKS
- 专利标题（中）： 大批芯片堆栈的芯片包装
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申请号： US13764331申请日： 2013-02-11
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公开(公告)号： US20140225273A1公开(公告)日： 2014-08-14
- 发明人: Hiren D. Thacker , John E. Cunningham , Ashok Krishnamoorthy
- 申请人： ORACLE INTERNATIONAL CORPORATION
- 申请人地址： US CA Redwood City
- 专利权人： ORACLE INTERNATIONAL CORPORATION
- 当前专利权人： ORACLE INTERNATIONAL CORPORATION
- 当前专利权人地址： US CA Redwood City
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L21/02
摘要：
A chip package is described. This chip package includes a substrate having a side at an angle relative to the top and bottom surfaces of the substrate that is between that of a direction parallel to the top and bottom surfaces and that of a direction perpendicular to the top and bottom surfaces (i.e., between 0° and 90°). This side may be configured to couple to a stack of semiconductor dies in which the semiconductor dies are offset from each other in a direction parallel to the top and bottom surfaces so that one side of the stack defines a stepped terrace. For example, the side may include electrical pads. These electrical pads may be coupled to electrical pads on the top surface by through-substrate vias (TSVs) in the substrate. Moreover, the electrical pads on the top surface may be configured to couple to an integrated circuit.
公开/授权文献
- US08975754B2 Chip package for high-count chip stacks 公开/授权日：2015-03-10
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