Invention Application
US20140227072A1 WAFER TRANSFER BLADE AND WAFER TRANSFER APPARATUS HAVING THE SAME
审中-公开
带有转印刀片的转印刀片和带有转印器的转印器具
- Patent Title: WAFER TRANSFER BLADE AND WAFER TRANSFER APPARATUS HAVING THE SAME
- Patent Title (中): 带有转印刀片的转印刀片和带有转印器的转印器具
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Application No.: US14178392Application Date: 2014-02-12
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Publication No.: US20140227072A1Publication Date: 2014-08-14
- Inventor: Dong-Yoon LEE , Jun-Young MUN , Dong-Il PARK , Suk-Yong JUNG , Bo-Young HWANG
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2013-0015605 20130214
- Main IPC: H01L21/683
- IPC: H01L21/683 ; B25J15/00 ; B25J15/06
Abstract:
A wafer transfer blade including a body including metal oxide and configured to support a wafer, and an adsorbing part on the body, the adsorbing part having at least one therein and configured to apply vacuum pressure to attach the wafer on the body may be provided. The body may include metal oxide to prevent static electricity.
Information query
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