公开(公告)号：US20140227072A1

公开(公告)日：2014-08-14

申请号：US14178392

申请日：2014-02-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-Yoon LEE ,  Jun-Young MUN ,  Dong-Il PARK ,  Suk-Yong JUNG ,  Bo-Young HWANG

IPC: H01L21/683 ,  B25J15/00 ,  B25J15/06

CPC classification number: H01L21/6838 ,  H01L21/68707

Abstract: A wafer transfer blade including a body including metal oxide and configured to support a wafer, and an adsorbing part on the body, the adsorbing part having at least one therein and configured to apply vacuum pressure to attach the wafer on the body may be provided. The body may include metal oxide to prevent static electricity.

Abstract translation: 可以提供一种晶片转印刀片，其包括包括金属氧化物并构造成支撑晶片的主体和主体上的吸附部分，所述吸附部分具有至少一个并且构造成施加真空压力以将晶片附着在主体上。 身体可以包括金属氧化物以防止静电。