Invention Application
- Patent Title: LED Sub-Mount and Method for Manufacturing Light Emitting Device Using the Sub-Mount
- Patent Title (中): LED子座和使用子座制造发光装置的方法
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Application No.: US14175419Application Date: 2014-02-07
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Publication No.: US20140231858A1Publication Date: 2014-08-21
- Inventor: Chia-En Lee , Cheng-Ta Kuo , Der-Ling Hsia
- Applicant: Lextar Electronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Lextar Electronics Corporation
- Current Assignee: Lextar Electronics Corporation
- Current Assignee Address: TW Hsinchu
- Priority: TW102105551 20130218
- Main IPC: H01L33/48
- IPC: H01L33/48 ; H01L33/62
Abstract:
A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.
Public/Granted literature
- US09461213B2 LED sub-mount and method for manufacturing light emitting device using the sub-mount Public/Granted day:2016-10-04
Information query
IPC分类:
