公开(公告)号：US09153736B2

公开(公告)日：2015-10-06

申请号：US14298826

申请日：2014-06-06

Applicant: LEXTAR ELECTRONICS CORPORATION

Inventor： Hsiu-Mei Chou ,  Jui-Yi Chu ,  Cheng-Ta Kuo

IPC: H01L33/14 ,  H01L21/266 ,  H01L33/22 ,  H01L33/06 ,  H01L33/02

CPC classification number: H01L33/145 ,  H01L21/2654 ,  H01L21/26586 ,  H01L29/34 ,  H01L33/0095 ,  H01L33/025 ,  H01L33/20 ,  H01L33/22

Abstract: The invention provides a light-emitting diode device and a method for fabricating the same. The light-emitting diode device includes a metal substrate. A light-emitting diode structure is bonded on the metal substrate. The light-emitting diode structure includes a first type semiconductor substrate and a second type semiconductor layer. The first type semiconductor layer has a first surface and a second surface opposite to the first surface. The second type semiconductor layer is in contact with the metal substrate. A light-emitting layer is disposed between the first type semiconductor substrate and the second type semiconductor layer. A portion of the second surface and a sidewall adjacent to the second surface are uneven roughened surfaces.

Abstract translation: 本发明提供一种发光二极管装置及其制造方法。 发光二极管装置包括金属基板。 发光二极管结构结合在金属基板上。 发光二极管结构包括第一类型半导体衬底和第二类型半导体层。 第一类型半导体层具有与第一表面相对的第一表面和第二表面。 第二类型半导体层与金属基板接触。 发光层设置在第一类型半导体衬底和第二类型半导体层之间。 第二表面的一部分和与第二表面相邻的侧壁是不均匀的粗糙表面。

公开(公告)号：US09447959B2

公开(公告)日：2016-09-20

申请号：US14290971

申请日：2014-05-29

Applicant: Lextar Electronics Corporation

Inventor： Li-Cheng Yang ,  Yu-Chun Lee ,  Cheng-Ta Kuo

IPC: F21V29/00 ,  F21V29/85 ,  F21V29/83 ,  H01L23/467 ,  H01L33/64 ,  F21Y101/02

CPC classification number: F21V29/85 ,  F21V29/83 ,  F21Y2101/00 ,  F21Y2115/10 ,  H01L23/467 ,  H01L33/648 ,  H01L2924/0002 ,  H01L2924/00

Abstract: The disclosure provides a heat sink for electrical elements and a light-emitting device containing thereof. The heat sink includes a radiating substrate and at least one hollow radiating channel. In which, the hollow radiating channel is horizontally embedded in the radiating substrate, and has two openings disposed on the same site or the opposite sites of the radiating substrate, so that gas may flow in the hollow radiating channel and remove heat of the radiating substrate. And a light-emitting device containing the heat sink is also provided.

Abstract translation: 本公开提供了用于电气元件的散热器和包含其的发光装置。 散热器包括辐射基板和至少一个中空辐射通道。 其中，中空辐射通道水平嵌入辐射基板，并且具有设置在辐射基板的相同位置或相对位置上的两个开口，使得气体可以在中空辐射通道中流动并且去除辐射基板的热量 。 还提供了包含散热器的发光装置。

公开(公告)号：US20140231858A1

公开(公告)日：2014-08-21

申请号：US14175419

申请日：2014-02-07

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/486 ,  H01L2224/13 ,  H01L2933/0066

Abstract: A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.

Abstract translation: LED子座包括衬底主体和多个第一导电层。 基板主体具有第一表面。 第一导电层位于基板主体的第一表面上，其中每相邻两个第一导电层之间的第一表面具有粘合剂填充槽。

公开(公告)号：US10811578B1

公开(公告)日：2020-10-20

申请号：US16367232

申请日：2019-03-27

Applicant: Lextar Electronics Corporation

Inventor： Chih-Hao Lin ,  Chun-Peng Lin ,  Chang-Han Chen ,  Kuang-Neng Yang ,  Cheng-Ta Kuo

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/62 ,  H01L33/58 ,  H01L33/48

Abstract: A LED carrier includes a substrate, a conductive layer, an adhesive layer, and a reflector. The conductive layer is disposed on the substrate, and has a bonding portion and an extending portion. The bonding portion has a top surface higher than a top surface of the extending portion. The adhesive layer covers the extending portion of the conductive layer and exposes the bonding portion of the conductive layer. The reflector is disposed over the adhesive layer. The adhesive layer has a hook portion in contact with a corner of the reflector.

公开(公告)号：US20160380173A1

公开(公告)日：2016-12-29

申请号：US15259266

申请日：2016-09-08

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/62 ,  H01L33/22 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/486 ,  H01L2224/13 ,  H01L2933/0066

Abstract: A light emitting device manufacturing method includes the following steps. A sub-mount, which has a plurality of electrical-conductive layers, is provided, and a surface between every adjacent two of the electrical-conductive layers has an adhesive-filling groove. An LED chip, which has a bottom substrate, is mounted on the sub-mount by a flip-chip way, and two electrodes of the LED chip are in contact with adjacent two of the electrical-conductive layers. Glue is filled along the adhesive-filling groove to be guided into a gap between the LED chip and the sub-mount.

Abstract translation: 发光器件制造方法包括以下步骤。 提供具有多个导电层的子座，并且每个相邻的两个导电层之间的表面具有粘合剂填充槽。 具有底部衬底的LED芯片通过倒装芯片方式安装在子座上，并且LED芯片的两个电极与相邻的两个导电层接触。 胶粘剂沿着胶粘剂填充槽填充以被引导到LED芯片和副底座之间的间隙中。

公开(公告)号：US09461213B2

公开(公告)日：2016-10-04

申请号：US14175419

申请日：2014-02-07

Applicant: Lextar Electronics Corporation

Inventor： Chia-En Lee ,  Cheng-Ta Kuo ,  Der-Ling Hsia

IPC: H01L33/48 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/486 ,  H01L2224/13 ,  H01L2933/0066

Abstract: A LED sub-mount includes a substrate body and a plurality of first electrical-conductive layers. The substrate body has a first surface. The first electrical-conductive layers are positioned on the first surface of the substrate body, wherein the first surface between every adjacent two of the first electrical-conductive layers has an adhesive-filling groove.

Abstract translation: LED子座包括衬底主体和多个第一导电层。 基板主体具有第一表面。 第一导电层位于基板主体的第一表面上，其中每相邻两个第一导电层之间的第一表面具有粘合剂填充槽。