Invention Application
US20140237816A1 Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board
审中-公开
用于制造用于印刷电路板的Z定向部件的挤出工艺
- Patent Title: Extrusion Process for Manufacturing a Z-Directed Component for a Printed Circuit Board
- Patent Title (中): 用于制造用于印刷电路板的Z定向部件的挤出工艺
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Application No.: US14268265Application Date: 2014-05-02
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Publication No.: US20140237816A1Publication Date: 2014-08-28
- Inventor: Paul Kevin Hall , Keith Bryan Hardin , Zachary Charles Nathan Kratzer , Qing Zhang
- Applicant: LEXMARK INTERNATIONAL, INC.
- Applicant Address: US KY Lexington
- Assignee: LEXMARK INTERNATIONAL, INC.
- Current Assignee: LEXMARK INTERNATIONAL, INC.
- Current Assignee Address: US KY Lexington
- Main IPC: H05K3/10
- IPC: H05K3/10
Abstract:
A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes extruding a substrate material according to the shape of the Z-directed component. A conductive material is then selectively applied to the extruded substrate material and the Z-directed component is formed from the extruded substrate material.
Information query
