Invention Application
- Patent Title: SUBSTRATE PROCESSING APPARATUS, MONITORING DEVICE OF SUBSTRATE PROCESSING APPARATUS, AND MONITORING METHOD OF SUBSTRATE PROCESSING APPARATUS
- Patent Title (中): 基板处理装置,基板处理装置的监视装置以及基板处理装置的监视方法
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Application No.: US14183912Application Date: 2014-02-19
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Publication No.: US20140240486A1Publication Date: 2014-08-28
- Inventor: Motoi OKADA , Shigeyuki IIDA
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Priority: JP2013-033541 20130222
- Main IPC: G01N21/95
- IPC: G01N21/95

Abstract:
Disclosed is monitoring device of monitoring a state of a substrate processing process in a substrate processing apparatus. The monitoring device includes: an imaging unit configured to image a processing state of the substrate processing process; a storage unit; a storage control unit configured to store a moving picture imaged by the imaging unit after adding a time stamp to the moving picture; a group classification unit configured to group a plurality of moving pictures stored in the storage unit into moving pictures of a normal group and moving pictures of a group other than the normal group; and a threshold generation unit configured to generate a threshold for detecting an abnormal moving picture based on the moving pictures of the normal group grouped by the group classification unit.
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