发明申请
- 专利标题: FILL PACK ASSEMBLY AND METHOD WITH BONDED SHEET PAIRS
- 专利标题(中): 填充组件和方法与粘结片对
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申请号: US14285778申请日: 2014-05-23
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公开(公告)号: US20140252664A1公开(公告)日: 2014-09-11
- 发明人: Eldon F. MOCKRY , Ohler L. Kinney, JR. , Kenneth P. MORTENSEN , Glenn S. BRENNEKE
- 申请人: SPX Cooling Technologies, Inc.
- 主分类号: F28F25/02
- IPC分类号: F28F25/02
摘要:
A fill pack assembly and method for assembling a fill pack from individual sheets utilizes integrally bonded sheet pairs. Each sheet pair is a pair of two individual adjacent fill sheets which have been bonded together via any suitable bonding method. A plurality of the thus formed sheet pairs can then be attached together to form an entire fill pack or portion of a fill pack. Such fill packs are useful in heat exchange devices such as industrial cooling towers.
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