发明申请
- 专利标题： WAFER HANDLING APPARATUS
- 专利标题（中）： 水处理设备
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申请号： US13800768申请日： 2013-03-13
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公开(公告)号： US20140265392A1公开(公告)日： 2014-09-18
- 发明人: Paul E. Pergande , Charles T. Carlson
- 申请人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- 申请人地址： US MA Gloucester
- 专利权人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- 当前专利权人： VARIAN SEMICONDUCTOR EQUIPMENT ASSOCIATES, INC.
- 当前专利权人地址： US MA Gloucester
- 主分类号： B25J15/00
- IPC分类号： B25J15/00
摘要：
Disclosed is a wafer support and alignment apparatus. The wafer support and alignment apparatus includes a wafer support component adapted to seat, align and support a wafer. The wafer support component includes at least one flat portion to support the wafer, at least one alignment lip portion protruding upward from the at least one flat portion, and at least one recessed pocket carved out of a portion of the at least one base portion. The at least one recessed pocket is adapted to receive at least one pad.
公开/授权文献
- US09004564B2 Wafer handling apparatus 公开/授权日：2015-04-14
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