发明申请
- 专利标题: CHIP PACKAGE CONNECTOR ASSEMBLY
- 专利标题(中): 芯片包装连接器总成
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申请号: US13826614申请日: 2013-03-14
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公开(公告)号: US20140268577A1公开(公告)日: 2014-09-18
- 发明人: Rajasekaran Raja Swaminathan , Donald T. Tran , Brent S. Stone , Ram Viswanath
- 申请人: Rajasekaran Raja Swaminathan , Donald T. Tran , Brent S. Stone , Ram Viswanath
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K1/02
摘要:
This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.
公开/授权文献
- US09674954B2 Chip package connector assembly 公开/授权日:2017-06-06