公开(公告)号：US20140268577A1

公开(公告)日：2014-09-18

申请号：US13826614

申请日：2013-03-14

申请人： Rajasekaran Raja Swaminathan ,  Donald T. Tran ,  Brent S. Stone ,  Ram Viswanath

发明人： Rajasekaran Raja Swaminathan ,  Donald T. Tran ,  Brent S. Stone ,  Ram Viswanath

IPC分类号： H05K1/11 ,  H05K1/02

CPC分类号： H05K1/11 ,  H01R12/62 ,  H05K1/0204 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/117 ,  H05K1/181 ,  H05K2201/094 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10378 ,  Y02P70/611

摘要： This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly.

摘要翻译： 本公开总体上涉及一种芯片封装组件，其被布置为电耦合到包括多个电路板触点的电路板。 芯片封装组件可以包括包括第一侧和第二侧的芯片封装，第二侧包括布置成电耦合到多个电路板触点的第一多个触点，以及布置成电耦合的第二多个触点 通过连接器组件连接到远程设备。

公开(公告)号：US20140273555A1

公开(公告)日：2014-09-18

申请号：US13826998

申请日：2013-03-14

申请人： Gaurav Chawla ,  Rajasekaran Raja Swaminathan ,  Donald T. Tran

发明人： Gaurav Chawla ,  Rajasekaran Raja Swaminathan ,  Donald T. Tran

IPC分类号： H01R12/71

CPC分类号： H01R12/71 ,  H01R12/53 ,  H01R12/57 ,  H01R25/006

摘要： This disclosure relates generally to a connector assembly. Optionally, first conductive members form a first row. Second conductive members include a first subset forming a second row and a second subset forming a third row, the second and third rows being parallel and offset with respect to one another. Individual ones of the first and second conductive members are arranged to be coupled at a first end to a corresponding contact. At least one of the first and second subsets has a vertical displacement to form a common row of the second conductive members at a second end of the second conductive members. Individual ones of the first conductive members are arranged to be coupled proximate a second end of the first conductive members to the second end of a corresponding one of the second conductive members.

摘要翻译： 本公开总体上涉及连接器组件。 可选地，第一导电构件形成第一行。 第二导电构件包括形成第二行的第一子集和形成第三行的第二子集，第二和第三行相对于彼此平行和偏移。 第一和第二导电构件中的各个被布置成在第一端耦合到相应的触点。 第一和第二子集中的至少一个具有垂直位移，以在第二导电构件的第二端处形成第二导电构件的公共排。 第一导电构件中的各个被布置成在第一导电构件的第二端附近耦合到相应的一个第二导电构件的第二端。