Invention Application
- Patent Title: OPTICAL INTERCONNECT IN HIGH-SPEED MEMORY SYSTEMS
- Patent Title (中): 高速存储器系统中的光学互连
-
Application No.: US14263321Application Date: 2014-04-28
-
Publication No.: US20140281199A1Publication Date: 2014-09-18
- Inventor: Jacob Baker , Brent Keeth
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Main IPC: G11C11/42
- IPC: G11C11/42
Abstract:
A optical link for achieving electrical isolation between a controller and a memory device is disclosed. The optical link increases the noise immunity of electrical interconnections, and allows the memory device to be placed a greater distance from the processor than is conventional without power-consuming I/O buffers.
Public/Granted literature
- US09299423B2 Optical interconnect in high-speed memory systems Public/Granted day:2016-03-29
Information query
