Invention Application
- Patent Title: ELECTRONIC DEVICE PACKAGE
- Patent Title (中): 电子设备包装
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Application No.: US14298436Application Date: 2014-06-06
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Publication No.: US20140284792A1Publication Date: 2014-09-25
- Inventor: Wei-Ming CHEN , Shu-Ming CHANG
- Applicant: XINTEC INC.
- Main IPC: H01L23/498
- IPC: H01L23/498

Abstract:
A chip package is disclosed. The package includes a carrier substrate, at least two semiconductor chips, a fill material layer, a protective layer, and a plurality of conductive bumps. The carrier substrate includes a grounding region. The semiconductor chips are disposed overlying the grounding region of the carrier substrate. Each semiconductor chip includes at least one signal pad and includes at least one grounding pad electrically connected to the grounding region. The fill material layer is formed overlying the carrier substrate and covers the semiconductor chips. The protective layer covers the fill material layer. The plurality of conductive bumps is disposed overlying the protective layer and is electrically connected to the semiconductor chips. A fabrication method of the chip package is also disclosed.
Public/Granted literature
- US08860217B1 Electronic device package Public/Granted day:2014-10-14
Information query
IPC分类: