Invention Application
- Patent Title: SYSTEMS AND METHODS FOR PROVIDING MODULAR PACKAGING
- Patent Title (中): 用于提供模块化包装的系统和方法
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Application No.: US14147530Application Date: 2014-01-04
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Publication No.: US20140306586A1Publication Date: 2014-10-16
- Inventor: Jason A. Sullivan
- Applicant: Jason A. Sullivan
- Main IPC: G06F1/18
- IPC: G06F1/18 ; H05K5/02 ; H05K5/00

Abstract:
Systems and methods for providing modular packaging that includes a base that is configured to receive any of a number of tops or lids, wherein the particular top or lid used in association with the base is determined based upon the volume needed within the overall packaging to contain, support and protect the contents inside the packaging. In at least some implementations, the lid or top is configured to cover the item to be packaged and mate with the base to form an enclosure. The base includes a bottom portion and a top portion such that the combination forms a cavity for inclusion of other items to be packaged along with the item that is enclosed within the top or lid. The top portion of the base provides a mounting platform with a connector. An outer skin or covering is provided over the top and base combination.
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