Invention Application
- Patent Title: Multi-Region Processing System and Heads
- Patent Title (中): 多区域处理系统和头
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Application No.: US14321198Application Date: 2014-07-01
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Publication No.: US20140311408A1Publication Date: 2014-10-23
- Inventor: Indranil De , Rick Endo , James Tsung , Kurt Weiner , Maosheng Zhao
- Applicant: Intermolecular, Inc.
- Main IPC: C23C16/455
- IPC: C23C16/455
Abstract:
The various embodiments of the invention provide for relative movement of the substrate and a process head to access the entire wafer in a minimal space to conduct combinatorial processing on various regions of the substrate. The heads enable site isolated processing within the chamber described and method of using the same are described.
Information query
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