A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.