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24 条记录 (耗时 0.012 秒)

    WAFER-LIKE SENSOR
    1.
    发明申请
    WAFER-LIKE SENSOR 审中-公开

    公开(公告)号：US20200152494A1

    公开(公告)日：2020-05-14

    申请号：US16678278

    申请日：2019-11-08

    申请人： CyberOptics Corporation

    发明人： Felix J. Schuda ,  Mark C. Leclair

    IPC分类号： H01L21/67 ,  G05B19/418

    摘要： A wafer-like semiconductor sensor includes a wafer-like base formed of a plurality of layers of chemically-hardened glass and an electronics module mounted to a recessed pocket in the base and containing a sensor.

    STRUCTURED LIGHT PROJECTION FOR SPECULAR SURFACES
    2.
    发明申请
    STRUCTURED LIGHT PROJECTION FOR SPECULAR SURFACES 审中-公开

    公开(公告)号：US20190226835A1

    公开(公告)日：2019-07-25

    申请号：US16256460

    申请日：2019-01-24

    申请人： CyberOptics Corporation

    发明人： Eric P. Rudd ,  Carl E. Haugan ,  Paul R. Haugen

    IPC分类号： G01B11/25 ,  G06K9/00 ,  G02B27/09 ,  H04N5/225

    摘要： A system for generating a three-dimensional height image of a reflective target includes an illumination source configured to generate a patterned illumination on the reflective target, and an imaging system configured to acquire an image of the patterned illumination on the reflective target, the illumination source and camera being aligned relative to the target such that the camera acquires a specular image of the patterned illumination. The system further including a controller coupled to the illumination source and the camera configured to generate a first height image of the target based on the acquired image, the first height image being used by the controller to determine a position, a height, and a tilt of the target and calculate an error function based on the determination to compensate the first height image for the calculated error.

    Automatic programming of solder paste inspection system
    4.
    发明授权
    Automatic programming of solder paste inspection system 有权

    公开(公告)号：US11176635B2

    公开(公告)日：2021-11-16

    申请号：US14160864

    申请日：2014-01-22

    申请人： CyberOptics Corporation

    发明人： Douglas G. Butler ,  Carl E. Haugan

    IPC分类号： G01N23/18 ,  G06T3/00 ,  G06T7/00 ,  G06K9/62

    摘要： A system for measuring solder paste stencil aperture positions and sizes is provided. The system includes at least one camera configured to acquire images of the stencil and an alignment target. A motion system generates relative motion between the at least one camera and the stencil. A controller is coupled to and controls the motion system. The controller is configured to analyze the images to generate aperture information relative to the stencil. The aperture information is provided to automatically program a solder paste inspection system. Other features and benefits that characterize embodiments of the present invention will be apparent upon reading the following detailed description and review of the associated drawings.

    THREE-DIMENSIONAL SENSOR WITH COUNTERPOSED CHANNELS
    5.
    发明申请
    THREE-DIMENSIONAL SENSOR WITH COUNTERPOSED CHANNELS 有权

    公开(公告)号：US20210088328A1

    公开(公告)日：2021-03-25

    申请号：US17113753

    申请日：2020-12-07

    申请人： CyberOptics Corporation

    发明人： Paul R. Haugen ,  Evan J. Ribnick ,  Carl E. Haugan ,  Eric P. Rudd

    IPC分类号： G01B11/25 ,  G01B11/30 ,  H04N5/372

    摘要： A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

    ENHANCED ILLUMINATION CONTROL FOR THREE-DIMENSIONAL IMAGING
    7.
    发明申请
    ENHANCED ILLUMINATION CONTROL FOR THREE-DIMENSIONAL IMAGING 审中-公开
    用于三维成像的增强照明控制

    公开(公告)号：US20140320633A1

    公开(公告)日：2014-10-30

    申请号：US14255333

    申请日：2014-04-17

    申请人： CyberOptics Corporation

    发明人： Paul R. Haugen

    IPC分类号： G01N21/956 ,  H04N5/235

    CPC分类号： G01N21/956 ,  G01N2021/95646 ,  H04N5/2354 ,  H04N5/247

    摘要： A system for sensing a three-dimensional topology of a circuit board is provided. An illumination source generates patterned illumination from a first point of view. At least one camera acquires an image of the patterned illumination from a second point of view. A controller is coupled to the source, and to the at least one camera. The controller generates a height topology of the circuit board based on images acquired from first and second image detectors of the patterned illumination. The characteristics of the pattern illumination are modified based on knowledge of the circuit board to enhance the dynamic range of the sensor and to reject image defects caused by multipath reflections.

    摘要翻译： 提供一种用于感测电路板的三维拓扑的系统。 照明源从第一观点产生图案照明。 至少一个相机从第二观点获取图案化照明的图像。 控制器耦合到源和至少一个相机。 控制器基于从图案化照明的第一和第二图像检测器获取的图像来生成电路板的高度拓扑。 基于电路板的知识来修改图案照明的特征，以增强传感器的动态范围并且抑制由多路径反射引起的图像缺陷。

    Three-dimensional sensor with counterposed channels
    8.
    发明授权
    Three-dimensional sensor with counterposed channels 有权

    公开(公告)号：US11604062B2

    公开(公告)日：2023-03-14

    申请号：US17113753

    申请日：2020-12-07

    申请人： CyberOptics Corporation

    发明人： Paul R. Haugen ,  Evan J. Ribnick ,  Carl E. Haugan ,  Eric P. Rudd

    IPC分类号： G01B11/25 ,  G01B11/30 ,  H04N5/372

    摘要： A method of determining dimensional information of a target surface includes generating a first point cloud corresponding to a first plurality of reconstructed surface points of the target surface generated by a first imaging system-illumination source pair of a phase profilometry system; generating a second point cloud corresponding to a second plurality of reconstructed surface points of the target surface generated by a second imaging system-illumination source pair of the phase profilometry system; generating an initial estimate of the target surface based on the first and second point clouds; and refining the initial surface estimate using positions of the first and second point clouds and geometry of the first and second imaging system-illumination source pairs to generate a final point cloud.

    Point cloud merging from multiple cameras and sources in three-dimensional profilometry
    9.
    发明授权
    Point cloud merging from multiple cameras and sources in three-dimensional profilometry 有权

    公开(公告)号：US10346963B2

    公开(公告)日：2019-07-09

    申请号：US14850470

    申请日：2015-09-10

    申请人： CyberOptics Corporation

    发明人： Eric P. Rudd ,  Carl E. Haugan

    IPC分类号： G01B11/25 ,  G06T7/00 ,  G06T7/521 ,  G06T7/586

    摘要： A computer-implemented method of and system for measuring a three-dimensional surface are provided. The method includes projecting structured illumination on the surface and acquiring a plurality of sets of images. The sets of images are processed to obtain a plurality of point clouds. A spatial accumulator is defined. A first point cloud of the plurality of point clouds is combined with a second point cloud of the plurality of point clouds into the spatial accumulator. Spatial coordinates of the surface are generated based on the contents of the spatial accumulator.