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发明申请
US20140323066A1 MULTIPLE BAND MULTIPLE MODE TRANSCEIVER FRONT END FLIP-CHIP ARCHITECTURE AND CIRCUITRY WITH INTEGRATED POWER AMPLIFIERS 有权
多功能多模式收发器前端片式芯片结构和集成功率放大器的电路

  • 专利标题： MULTIPLE BAND MULTIPLE MODE TRANSCEIVER FRONT END FLIP-CHIP ARCHITECTURE AND CIRCUITRY WITH INTEGRATED POWER AMPLIFIERS
  • 专利标题（中）： 多功能多模式收发器前端片式芯片结构和集成功率放大器的电路
  • 申请号： US14260130
    申请日： 2014-04-23
  • 公开(公告)号： US20140323066A1
    公开(公告)日： 2014-10-30
  • 发明人: LISETTE L. ZHANG , OLEKSANDR GORBACHOV
  • 申请人： RFAXIS, INC.
  • 申请人地址： US CA Irvine
  • 专利权人： RFAXIS, INC.
  • 当前专利权人： RFAXIS, INC.
  • 当前专利权人地址： US CA Irvine
  • 主分类号： H04B1/00
  • IPC分类号： H04B1/00
MULTIPLE BAND MULTIPLE MODE TRANSCEIVER FRONT END FLIP-CHIP ARCHITECTURE AND CIRCUITRY WITH INTEGRATED POWER AMPLIFIERS
摘要：
An integrated circuit architecture and circuitry is defined by a die structure with a plurality of exposed conductive pads arranged in a grid of rows and columns. The die structure has a first operating frequency region with a first transmit and receive chain, and a second operating frequency region with a second transmit chain and a second receive chain. There is a shared region of the die structure defined by an overlapping segment of the first operating frequency region and the second operating frequency region with a shared power supply input conductive pad connected to the first transmit chain, the second transmit chain, the first receive chain, and the second receive chain, and a shared power detection output conductive pad connected to the first transmit chain and the second transmit chain.
摘要（中）：

集成电路架构和电路由具有布置在行和列格栅中的多个暴露的导电焊盘的管芯结构限定。 管芯结构具有带有第一发射和接收链的第一工作频率区域和具有第二发射链和第二接收链的第二工作频率区域。 存在由第一工作频率区域和第二工作频率区域的重叠段限定的管芯结构的共享区域，其中共享电源输入导电焊盘连接到第一发射链，第二发射链，第一接收链 和第二接收链，以及连接到第一发送链和第二发送链的共享功率检测输出导电焊盘。

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