发明申请
- 专利标题： LIGHT EMITTING DIODE COMPONENT
- 专利标题（中）： 发光二极管组件
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申请号： US13886878申请日： 2013-05-03
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公开(公告)号： US20140328046A1公开(公告)日： 2014-11-06
- 发明人: Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
- 申请人： Srinath K. Aanegola , Emil V. Radkov , James Reginelli , Larry R. Stadelman , Matthew Mrakovich , Tomislav J. Stimac
- 主分类号： F21K99/00
- IPC分类号： F21K99/00 ; F21V13/08
摘要：
In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.
公开/授权文献
- US10309587B2 Light emitting diode component 公开/授权日：2019-06-04
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