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    Flexible lighting strips employing light-emitting diodes
    3.
    发明授权
    Flexible lighting strips employing light-emitting diodes 有权
    采用发光二极管的柔性照明条

    公开(公告)号：US07686477B2

    公开(公告)日：2010-03-30

    申请号：US12172705

    申请日：2008-07-14

    申请人： Paul Southard ,  Srinath K. Aanegola ,  James T. Petroski ,  Christopher Bohler

    发明人： Paul Southard ,  Srinath K. Aanegola ,  James T. Petroski ,  Christopher Bohler

    IPC分类号： F21S4/00

    CPC分类号： G09F13/22 ,  F21S4/20 ,  F21V21/002 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/0404 ,  G09F13/0413 ,  Y10S362/80 ,  Y10S362/812

    摘要： An illuminated sign (88) includes a flexible electrical power cord (100) including first and second parallel conductors (112, 114) surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (112, 114). A plurality of light emitting diode (LED) devices (102) are affixed to the cord (100). Each LED device (102) includes an LED (104) having a positive lead (130P) electrically communicating with the first parallel conductor (112) and a negative lead (130P) electrically communicating with the second parallel conductor (114). A stencil (92) defines a selected shape, and the electrical cord (100) is arranged on the stencil (92). Power conditioning electronics (210, 220) disposed away from the stencil (92) electrically communicate with the first and second parallel conductors (112, 114) of the electrical power cord (100). The power conditioning electronics (210, 220) power the LED devices (102) via the parallel conductors (112, 114).

    摘要翻译： 照明标志（88）包括柔性电源线（100），其包括围绕包含在绝缘护套内的第一和第二平行导体（112,114），其限定了平行导体（112,114）之间恒定的间隔距离。 多个发光二极管（LED）装置（102）固定到电缆（100）上。 每个LED装置（102）包括具有与第一并联导体（112）电连通的正极（130P）的LED（104）和与第二平行导体（114）电连通的负极引线（130P）。 模板（92）限定所选择的形状，并且电线（100）布置在模板（92）上。 远离模板（92）设置的功率调节电子器件（210,220）与电源线（100）的第一和第二平行导体（112,114）电连通。 功率调节电子器件（210,220）经由并联导体（112,114）为LED器件（102）供电。

    ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME
    4.
    发明申请
    ENVIRONMENTALLY ROBUST LIGHTING DEVICES AND METHODS OF MANUFACTURING SAME 有权
    环保的照明设备及其制造方法

    公开(公告)号：US20080296607A1

    公开(公告)日：2008-12-04

    申请号：US12129925

    申请日：2008-05-30

    申请人： Jeffrey Marc Nall ,  Srinath K. Aanegola ,  Koushik Saha ,  Xin Wang ,  Kevin Carpenter

    发明人： Jeffrey Marc Nall ,  Srinath K. Aanegola ,  Koushik Saha ,  Xin Wang ,  Kevin Carpenter

    IPC分类号： H01L33/00 ,  H01L21/00

    CPC分类号： H01L33/56 ,  H01L33/501 ,  H01L33/54

    摘要： An illustrative lighting device comprises: a light emitting chip; a silicone encapsulant disposed over the light emitting chip; and a light transmissive vinyl or acrylic layer sealing an assembly including at least the silicone encapsulant and the light emitting chip. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip using a light transmissive vinyl or acrylic layer. An illustrative method of fabricating a lighting device comprises: encapsulating a light emitting chip with a silicone encapsulant; and sealing an assembly including at least the silicone encapsulant and the light emitting chip by disposing a light transmissive plastic layer as a unit over the assembly.

    摘要翻译： 说明性照明装置包括：发光芯片; 设置在所述发光芯片上的硅氧烷密封剂; 以及密封包括至少硅树脂密封剂和发光芯片的组件的透光乙烯基或丙烯酸层。 制造照明装置的说明性方法包括：用硅胶密封剂封装发光芯片; 以及使用透光乙烯基或丙烯酸层密封至少包括硅氧烷密封剂和发光芯片的组件。 制造照明装置的说明性方法包括：用硅胶密封剂封装发光芯片; 以及通过在所述组件上设置透光塑料层作为单元来密封包括至少所述硅酮密封剂和所述发光芯片的组件。

    Small footprint high power light emitting package with plurality of light emitting diode chips
    8.
    发明申请
    Small footprint high power light emitting package with plurality of light emitting diode chips 审中-公开
    具有多个发光二极管芯片的小尺寸大功率发光封装

    公开(公告)号：US20080121902A1

    公开(公告)日：2008-05-29

    申请号：US11517053

    申请日：2006-09-07

    申请人： Michael Sackrison ,  Xiang Gao ,  Srinath K. Aanegola ,  Hari S. Venugopalan

    发明人： Michael Sackrison ,  Xiang Gao ,  Srinath K. Aanegola ,  Hari S. Venugopalan

    IPC分类号： H01L33/00

    CPC分类号： H01L25/0756 ,  H01L25/0753 ,  H01L33/0079 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A light emitting package includes a support (12, 112, 212) defining a support surface (14). A first light emitting diode chip (20, 120, 220) is secured to the supporting surface and is configured to emit light having a first spectral distribution. A second light emitting diode chip (22, 122, 123, 222) is secured to the first light emitting diode chip. The second light emitting diode chip is configured to emit light having a second spectral distribution different from the first spectral distribution. Optionally, a third light emitting diode chip (223) is disposed on the second light emitting diode chip (222).

    摘要翻译： 发光包装包括限定支撑表面（14）的支撑件（12,112,212）。 第一发光二极管芯片（20,120,220）固定到支撑表面并且被配置为发射具有第一光谱分布的光。 第二发光二极管芯片（22,122,123,222）固定到第一发光二极管芯片。 第二发光二极管芯片被配置为发射具有与第一光谱分布不同的第二光谱分布的光。 可选地，第三发光二极管芯片（223）设置在第二发光二极管芯片（222）上。