发明申请
US20140332937A1 WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A WORKPIECE WITH SEMICONDUCTOR CHIPS
审中-公开
具有半导体器件的半导体器件和半导体器件的制造方法以及用半导体器件制造工件的方法
- 专利标题： WORKPIECE WITH SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING A WORKPIECE WITH SEMICONDUCTOR CHIPS
- 专利标题（中）： 具有半导体器件的半导体器件和半导体器件的制造方法以及用半导体器件制造工件的方法
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申请号： US14330066申请日： 2014-07-14
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公开(公告)号： US20140332937A1公开(公告)日： 2014-11-13
- 发明人: Markus Brunnbauer , Thorsten Meyer , Stephan Bradl , Ralf Plieninger , Jens Pohl , Klaus Pressel , Recai Sezi
- 申请人： Markus Brunnbauer , Thorsten Meyer , Stephan Bradl , Ralf Plieninger , Jens Pohl , Klaus Pressel , Recai Sezi
- 优先权： DE102007020656.0 20070430
- 主分类号： H01L23/60
- IPC分类号： H01L23/60 ; H01L23/48
摘要：
A workpiece has at least two semiconductor chips, each semiconductor chip having a first main surface, which is at least partially exposed, and a second main surface. The workpiece also comprises an electrically conducting layer, arranged on the at least two semiconductor chips, the electrically conducting layer being arranged at least on regions of the second main surface, and a molding compound, arranged on the electrically conducting layer.