Invention Application
- Patent Title: HIGH-FREQUENCY CIRCUIT MODULE
- Patent Title (中): 高频电路模块
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Application No.: US14455696Application Date: 2014-08-08
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Publication No.: US20140349596A1Publication Date: 2014-11-27
- Inventor: Tetsuo Saji , Hiroshi Nakamura
- Applicant: TAIYO YUDEN CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee: TAIYO YUDEN CO., LTD.
- Current Assignee Address: JP Tokyo
- Priority: JP2012-180527 20120816
- Main IPC: H04B1/40
- IPC: H04B1/40 ; H04B15/00

Abstract:
Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer for a first frequency band is mounted on a circuit substrate, and a second transmission filter and a second reception filter that constitute a second duplexer for a second frequency band are embedded in the circuit substrate. The second transmission filter and the second reception filter are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.
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