Invention Application
US20140356989A1 METHOD OF MANUFACTURING MEMS DEVICES WITH RELIABLE HERMETIC SEAL
有权
用可靠的密封封装制造MEMS器件的方法
- Patent Title: METHOD OF MANUFACTURING MEMS DEVICES WITH RELIABLE HERMETIC SEAL
- Patent Title (中): 用可靠的密封封装制造MEMS器件的方法
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Application No.: US13904681Application Date: 2013-05-29
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Publication No.: US20140356989A1Publication Date: 2014-12-04
- Inventor: Li Chen , Kuang L. Yang
- Applicant: Analog Devices, Inc.
- Applicant Address: US MA Norwood
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Current Assignee Address: US MA Norwood
- Main IPC: B81C1/00
- IPC: B81C1/00 ; H01L21/66
Abstract:
Manufactured capped MEMS device wafers are tested for hermeticity on a vacuum prober at differing pressures or on a wafer prober at differing temperatures. Resonant frequency testing is conducted. Leaking MEMS devices are distinguished from the remaining MEMS devices on the basis of quality factor (“Q”) measurements obtained from the resonant frequency testing.
Public/Granted literature
- US08921128B2 Method of manufacturing MEMS devices with reliable hermetic seal Public/Granted day:2014-12-30
Information query
