发明申请
- 专利标题: CAPILLARY BONDING TOOL AND METHOD OF FORMING WIRE BONDS
- 专利标题(中): 毛细结合工具和形成线束的方法
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申请号: US13924625申请日: 2013-06-24
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公开(公告)号: US20140374467A1公开(公告)日: 2014-12-25
- 发明人: Jia Lin Yap , Yin Kheng Au , Lai Cheng Law
- 申请人: Jia Lin Yap , Yin Kheng Au , Lai Cheng Law
- 主分类号: H01L23/00
- IPC分类号: H01L23/00 ; B23K20/26
摘要:
A capillary bonding tool for wire bonding includes a first section, a second section and a bonding section. The first section has a first outer peripheral sidewall, an opposing first inner sidewall that extends generally parallel to the central longitudinal axis, and a first opening surrounded by the first inner sidewall. The second section has a second outer peripheral sidewall, an opposing second inner sidewall that extends at an angle with respect to the central longitudinal axis, and a second tapered opening surrounded by the second inner sidewall. The bonding section has a peripheral ridge extending axially outwardly from the second inner sidewall of the second section. The peripheral ridge has a third outer peripheral sidewall, a third inner tubular sidewall that extends generally parallel to the central longitudinal axis and radially outwardly of the first inner sidewall, and a third opening surrounded by the third inner tubular sidewall.
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