Invention Application
US20140376857A1 PHOTONIC INTEGRATED CIRCUIT AND FABRICATION PROCESS 审中-公开
光电集成电路和制造工艺

PHOTONIC INTEGRATED CIRCUIT AND FABRICATION PROCESS
Abstract:
A photonic integrated circuit may include a silicon layer including a waveguide and at least one other photonic component. The photonic integrated circuit may also include a first insulating region arranged above a first side of the silicon layer and encapsulating at least one metallization level, a second insulating region arranged above a second side of the silicon layer and encapsulating at least one gain medium of a laser source optically coupled to the waveguide.
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