Invention Application
- Patent Title: PROTEIN COMPLEX, BISPECIFIC ANTIBODY INCLUDING THE PROTEIN COMPLEX, AND METHOD OF PREPARATION THEREOF
- Patent Title (中): 蛋白复合物,包括蛋白复合物的双重抗体及其制备方法
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Application No.: US14315068Application Date: 2014-06-25
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Publication No.: US20140378664A1Publication Date: 2014-12-25
- Inventor: Hye young SUH , Jae II Lee , Su-Jeong Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Priority: KR10-2013-0073358 20130625; KR10-2013-0073361 20130625
- Main IPC: C07K16/18
- IPC: C07K16/18

Abstract:
A protein complex comprising a first polypeptide comprising a first antigen-binding region; a second polypeptide comprising a second antigen-binding region; anda linker connecting the first polypeptide and the second polypeptide, wherein the first antigen-binding region is a single stranded polypeptide comprising a first light chain antigen-binding region and a first heavy chain antigen-binding region, the second antigen-binding region is a single stranded polypeptide comprising a second light chain antigen-binding region and a second heavy chain antigen-binding region, and the linker connects the C-terminal of the first polypeptide and the N-terminal of the second polypeptide, and comprises a tag including a cleavable amino acid sequence at one terminal or both terminals of the linker; as well as a bispecific antibody derived from the protein complex, and related compositions and methods.
Public/Granted literature
- US09879081B2 Protein complex, bispecific antibody including the protein complex, and method of preparation thereof Public/Granted day:2018-01-30
Information query