Invention Application
US20150000933A1 Method and Packages to Protect Electronics Components in a Subterranean Environment
审中-公开
在地下环境中保护电子元件的方法和封装
- Patent Title: Method and Packages to Protect Electronics Components in a Subterranean Environment
- Patent Title (中): 在地下环境中保护电子元件的方法和封装
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Application No.: US14366686Application Date: 2012-12-21
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Publication No.: US20150000933A1Publication Date: 2015-01-01
- Inventor: Andrew J. Parry , Lahcen Garando , Francois Barbara , Jacques Sellin , Henri Denoix , Gregoire Jacob , Junchen Liu
- Applicant: Schlumberger Technology Corporation
- Priority: EP11290614.4 20111226
- International Application: PCT/US12/71113 WO 20121221
- Main IPC: E21B47/01
- IPC: E21B47/01 ; H05K5/06 ; H05K7/02
Abstract:
Methods and packages for containing electronics components are described that use characteristic dimensions, so that the electronics components can remain electrically functional within the package subjected to harsh environments, such as a subterranean environment.
Information query
