Invention Application
US20150008021A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
审中-公开
印刷线路板和制造印刷线路板的方法
- Patent Title: PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Patent Title (中): 印刷线路板和制造印刷线路板的方法
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Application No.: US14316966Application Date: 2014-06-27
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Publication No.: US20150008021A1Publication Date: 2015-01-08
- Inventor: Naoto Ishida , Kota Noda
- Applicant: IBIDEN CO., LTD.
- Applicant Address: JP Ogaki-shi
- Assignee: IBIDEN CO., LTD.
- Current Assignee: IBIDEN CO., LTD.
- Current Assignee Address: JP Ogaki-shi
- Priority: JP2013-139937 20130703
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/11 ; H05K3/40 ; H05K1/09
Abstract:
A printed wiring board includes an interlayer resin insulation layer, multiple pads formed on the interlayer resin insulation layer, and multiple metal posts having bonding material portions and positioned on the pads, respectively, such that the metal posts are bonded to the pads through the bonding material portions of the metal posts, respectively.
Information query
