Invention Application
- Patent Title: Thermal Probe
- Patent Title (中): 热探头
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Application No.: US14498059Application Date: 2014-09-26
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Publication No.: US20150013957A1Publication Date: 2015-01-15
- Inventor: Thomas J. Van Dijk
- Applicant: Tasseron Sensors, Inc.
- Applicant Address: US PA Williamsport
- Assignee: Tasseron Sensors, Inc.
- Current Assignee: Tasseron Sensors, Inc.
- Current Assignee Address: US PA Williamsport
- Main IPC: F24F11/00
- IPC: F24F11/00 ; G01K7/22 ; G01K7/16
Abstract:
A temperature probe having a terminal attachment arrangement for securing and selectively releasing an electrical connection is disclosed. The temperature probe further includes a housing for sealing the temperature probe to a structure, such as a HVAC duct.
Information query
