Invention Application
- Patent Title: PRINTED CIRCUIT BOARD HAVING EMBEDDED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 具有嵌入式电子设备的印刷电路板及其制造方法
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Application No.: US14060365Application Date: 2013-10-22
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Publication No.: US20150014034A1Publication Date: 2015-01-15
- Inventor: Young Nam Hwang , Ju Wan Nam , Seung Wan Woo , Yee Na Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon
- Priority: KR10-2013-0083156 20130715
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K3/46 ; H05K3/30

Abstract:
Disclosed herein are a printed circuit board having an embedded electronic device and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board having an embedded electronic device includes: a core substrate having circuit layers formed on both surfaces thereof; a taper-shaped cavity formed on the core substrate; and an electronic device embedded in the cavity.
Public/Granted literature
- US09504169B2 Printed circuit board having embedded electronic device and method of manufacturing the same Public/Granted day:2016-11-22
Information query