Invention Application
- Patent Title: Method for Producing an Optoelectronic Semiconductor Component, and Optoelectronic Semiconductor Component
- Patent Title (中): 制造光电半导体元件的方法和光电半导体元件
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Application No.: US14378610Application Date: 2013-01-17
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Publication No.: US20150014737A1Publication Date: 2015-01-15
- Inventor: Stefan Illek , Walter Wegleiter , Karl Weidner , Stefan Stegmeier
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE Regensburg
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE Regensburg
- Priority: DE102012002605.6 20120213
- International Application: PCT/EP2013/050838 WO 20130117
- Main IPC: H01L33/64
- IPC: H01L33/64 ; H01L33/36 ; H01L33/52 ; H01L27/15 ; H01L33/00 ; H01L33/62
Abstract:
In at least one embodiment, the semiconductor component includes at least one optoelectronic semiconductor chip having a radiation exit side. The surface-mountable semiconductor component comprises a shaped body that covers side surfaces of the semiconductor chip directly and in a positively locking manner. The shaped body and the semiconductor chip do not overlap, as seen in a plan view of the radiation exit side.
Public/Granted literature
- US09653670B2 Method for producing an optoelectronic semiconductor component, and optoelectronic semiconductor component Public/Granted day:2017-05-16
Information query
IPC分类:
