发明申请
US20150017805A1 WAFER PROCESSING APPARATUS HAVING INDEPENDENTLY ROTATABLE WAFER SUPPORT AND PROCESSING DISH
审中-公开
具有独立可旋转波浪支撑和加工盘的加工设备
- 专利标题： WAFER PROCESSING APPARATUS HAVING INDEPENDENTLY ROTATABLE WAFER SUPPORT AND PROCESSING DISH
- 专利标题（中）： 具有独立可旋转波浪支撑和加工盘的加工设备
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申请号： US13937816申请日： 2013-07-09
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公开(公告)号： US20150017805A1公开(公告)日： 2015-01-15
- 发明人: Raymon F. Thompson
- 申请人： Raymon F. Thompson
- 主分类号： H01L21/67
- IPC分类号： H01L21/67 ; H01L21/306
摘要：
An apparatus for processing a wafer is disclosed that includes a wafer support and a processing base. The wafer support is configured to support a wafer in a processing position, and to rotate the wafer about a first substantially vertical axis while in the processing position. The processing base includes a shallow dish configured to receive processing chemistry. The wafer support places the wafer in contact with the processing chemistry while in the processing position. The shallow dish is rotatable about a second substantially vertical axis when the wafer support is in the processing position. The rotation of the wafer is independent of the rotation of the shallow dish. Further, the processing base may include a heating element, such as an infrared heating element, that is disposed to locally elevate the temperature of of the shallow dish and chemistry contained in it.
公开/授权文献
- US1348902A Speed-changing mechanism 公开/授权日：1920-08-10
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