发明申请
- 专利标题： MECHANISMS FOR FORMING PACKAGE STRUCTURE
- 专利标题（中）： 形成包装结构的机制
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申请号： US13943284申请日： 2013-07-16
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公开(公告)号： US20150021759A1公开(公告)日： 2015-01-22
- 发明人: Hsien-Wei CHEN
- 申请人： TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/00
摘要：
Embodiments of mechanisms for forming a package structure are provided. A method for forming a package structure includes providing a semiconductor die and forming a first bump structure and a second bump structure over the semiconductor die. The second bump structure is thinner and wider than the first bump structure.The method also includes providing a substrate having a first contact pad and a second contact pad formed on the substrate. The method further includes forming a first solder paste structure and a second solder paste structure over the first contact pad and the second contact pad, respectively. The second solder paste structure is thicker than the first solder paste structure. In addition, the method includes reflowing the first bump structure and the second bump structure with the first solder paste structure and the second solder paste structure, respectively, to bond the semiconductor die to the substrate.
公开/授权文献
- US08969191B2 Mechanisms for forming package structure 公开/授权日：2015-03-03
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