Invention Application
- Patent Title: HIGH-FREQUENCY SIGNAL LINE
- Patent Title (中): 高频信号线
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Application No.: US14509285Application Date: 2014-10-08
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Publication No.: US20150022288A1Publication Date: 2015-01-22
- Inventor: Noboru KATO , Satoshi ISHINO , Jun SASAKI
- Applicant: Murata Manufacturing Co., Ltd.
- Priority: JP2012-147304 20120629
- Main IPC: H01P3/00
- IPC: H01P3/00 ; H01P3/08

Abstract:
A high-frequency signal line includes a body with a first layer level and a second layer level; a signal line including a first line portion provided at the first layer level, a second line portion provided at the second layer level, and a first interlayer connection connecting the first line portion and the second line portion; a first ground conductor including a first ground portion provided at the first layer level; a second ground conductor including a second ground portion provided at the second layer level; and a second interlayer connection connecting the first ground portion and the second ground portion. A distance between the first interlayer connection and the second interlayer connection is not less than a maximum distance between the first line portion and the first ground portion and is not less than a maximum distance between the second line portion and the second ground portion.
Public/Granted literature
- US09583809B2 High-frequency signal line Public/Granted day:2017-02-28
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