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    SIGNAL LINE AND MANUFACTURING METHOD THEREFOR
    4.
    发明申请
    SIGNAL LINE AND MANUFACTURING METHOD THEREFOR 有权
    信号线及其制造方法

    公开(公告)号：US20150342028A1

    公开(公告)日：2015-11-26

    申请号：US14818369

    申请日：2015-08-05

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Noboru KATO ,  Jun SASAKI

    IPC: H05K1/02

    CPC classification number: H05K1/0218 ,  H05K1/028 ,  H05K3/28 ,  H05K3/4635 ,  H05K2201/0715 ,  Y10T29/49155

    Abstract: A signal line that is easily inflected includes a laminated body including at least insulator layers that include flexible material and are laminated from a positive direction side in a z axis direction to a negative direction side therein in this order. A ground conductor is securely fixed to a main surface on the positive direction side of the insulation sheet in the z axis direction. A signal line is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. A ground conductor is securely fixed to a main surface on the positive direction side of the insulator layer in the z axis direction. The ground conductors and the signal line define a stripline structure. The laminated body is inflected so that the insulator layer is located on an inner periphery side, compared with a location of the insulator layer.

    Abstract translation: 容易弯曲的信号线包括至少包括绝缘体层的层叠体，该绝缘体层包括柔性材料，并且从Z轴方向的正方向侧到其负向侧层叠。 接地导体牢固地固定在绝缘片的正方向侧的主面上，在z轴方向上。 信号线在z轴方向上牢固地固定在绝缘体层的正极侧的主表面上。 接地导体牢固地固定在绝缘体层的正方向侧的主面上，在z轴方向。 接地导体和信号线定义了带状线结构。 与绝缘体层的位置相比，层叠体弯曲，使得绝缘体层位于内周侧。

    FLAT CABLE
    6.
    发明申请
    FLAT CABLE 有权
    扁平电缆

    公开(公告)号：US20140299374A1

    公开(公告)日：2014-10-09

    申请号：US14312797

    申请日：2014-06-24

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Noboru KATO ,  Satoshi ISHINO ,  Jun SASAKI

    IPC: H01B7/08

    CPC classification number: H01B7/08 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0221 ,  H05K1/028 ,  H05K1/147

    Abstract: A flat cable includes a base material including a signal conductor extending in a first direction, a first ground conductor, and a second ground conductor. The second ground conductor includes elongated conductors extending in the first direction, and bridge conductors that connect the elongated conductors at predetermined spacings along the first direction. The second ground conductor is connected with via-hole conductors at predetermined positions in two mutually opposite directions along the first direction with respect to each of the bridge conductors. Countercurrents generated from a plurality of countercurrent generation points do not flow to the first ground conductor via a common via-hole but flow to the first ground conductor individually via separate via-hole conductors.

    Abstract translation: 扁平电缆包括基材，其包括沿第一方向延伸的信号导体，第一接地导体和第二接地导体。 第二接地导体包括在第一方向上延伸的细长导体以及沿着第一方向以预定间隔连接细长导体的桥导体。 第二接地导体相对于每个桥式导体沿着第一方向在两个相互相反的方向上的预定位置处与通孔导体连接。 从多个逆流发生点产生的逆流不经由公共通孔而流到第一接地导体，而是通过单独的通孔导体分别流到第一接地导体。

    MULTILAYER SUBSTRATE
    7.
    发明申请
    MULTILAYER SUBSTRATE 有权
    多层基板

    公开(公告)号：US20140166344A1

    公开(公告)日：2014-06-19

    申请号：US14183558

    申请日：2014-02-19

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

    IPC: H05K1/02

    CPC classification number: H05K1/0281 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/032 ,  H05K1/09 ,  H05K2201/0141 ,  H05K2201/057 ,  H05K2201/0715 ,  H05K2201/09018 ,  H05K2201/09409

    Abstract: A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors.

    Abstract translation: 保持弯曲状态而不引起电特性波动的多层基板包括：主体，其包括要堆叠并由柔性材料制成的多个绝缘片。 信号线在主体中延伸。 接地导体相对于主体中的信号线在z轴方向的正方向侧设置，并且在从z轴方向看的俯视图中与信号线重叠。 接地导体相对于主体中的信号线在z轴方向的负方向侧设置，并且在从z轴方向观察的俯视图中与信号线重叠。 主体弯曲的状态使得信号线定义为电弧，由接地导体的塑性变形保持。

    SIGNAL LINE AND CIRCUIT SUBSTRATE
    8.
    发明申请
    SIGNAL LINE AND CIRCUIT SUBSTRATE 有权
    信号线和电路基板

    公开(公告)号：US20140048312A1

    公开(公告)日：2014-02-20

    申请号：US14063072

    申请日：2013-10-25

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Noboru KATO ,  Jun SASAKI ,  Satoshi ISHINO

    IPC: H05K1/02

    CPC classification number: H05K1/0298 ,  H01P3/081 ,  H01P3/088 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/028 ,  H05K2201/0715 ,  H05K2201/09618

    Abstract: A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.

    Abstract translation: 信号线是设置在层叠体内的线状导体。 第一接地导体与信号线相比在层叠体中的z轴方向的正方向侧设置，并且在从z轴方向观察的平面视图中与信号线重叠。 第二接地导体与信号线相比在层叠体中的z轴方向的负方向侧设置，并且与从z轴方向看的平面图中的信号线重叠。 通孔导体将接地导体彼此连接。 在第一接地导体中，沿着从z轴方向看的平面图中的信号线布置多个开口部。 通孔导体设置在x轴方向上彼此相邻的开口部之间。

    ELECTRONIC APPARATUS
    9.
    发明申请
    ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：US20200161734A1

    公开(公告)日：2020-05-21

    申请号：US16751239

    申请日：2020-01-24

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Takahiro BABA ,  Nobuo IKEMOTO ,  Kosuke NISHINO ,  Jun SASAKI

    IPC: H01P3/08 ,  H05K1/02 ,  H05K1/14 ,  H05K1/11 ,  H05K1/03

    Abstract: An electronic apparatus includes a first substrate and a second substrate mounted on the first substrate and having a smaller area than the first substrate. The second substrate extends in a longitudinal direction and has a planar or substantially planar shape with a uniform or substantially uniform width across all portions of the second substrate in the longitudinal direction. The second substrate includes a signal line, and a high-frequency transmission line including the signal line, and further includes an input/output pad electrically connected to the signal line, and an auxiliary pad arranged between two input/output pads, on the mounting surface of the second substrate. The first substrate includes lands each connected to the input/output pad and the auxiliary pad. The input/output pad and the auxiliary pad are each soldered on each of the lands of the first substrate and, thus, the second substrate is surface-mounted on the first substrate.

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