发明申请
- 专利标题： METHODS FOR PRODUCING SEMICONDUCTOR DEVICES
- 专利标题（中）： 生产半导体器件的方法
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申请号： US13947135申请日： 2013-07-22
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公开(公告)号： US20150024550A1公开(公告)日： 2015-01-22
- 发明人: Andreas Voerckel
- 申请人： Infineon Technologies Austria AG
- 主分类号： H01L21/82
- IPC分类号： H01L21/82 ; H01L21/56 ; H01L21/768 ; H01L23/00
摘要：
A method for producing a semiconductor device in accordance with various embodiments may include providing a semiconductor workpiece attached to a first carrier; dicing the semiconductor workpiece and the carrier so as to form at least one individual semiconductor chip; mounting the at least one semiconductor chip with a side facing away from the carrier, to an additional carrier.
公开/授权文献
- US09548247B2 Methods for producing semiconductor devices 公开/授权日：2017-01-17
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