Invention Application
US20150037950A1 COMPACT THREE DIMENSIONAL VERTICAL NAND AND METHOD OF MAKING THEREOF
有权
紧凑的三维垂直NAND及其制作方法
- Patent Title: COMPACT THREE DIMENSIONAL VERTICAL NAND AND METHOD OF MAKING THEREOF
- Patent Title (中): 紧凑的三维垂直NAND及其制作方法
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Application No.: US14517122Application Date: 2014-10-17
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Publication No.: US20150037950A1Publication Date: 2015-02-05
- Inventor: Johann Alsmeier , Raghuveer S. Makala , Xiying Costa , Yanli Zhang
- Applicant: Sandisk Technologies Inc.
- Main IPC: H01L27/115
- IPC: H01L27/115 ; H01L29/66

Abstract:
A NAND device has at least a 3×3 array of vertical NAND strings in which the control gate electrodes are continuous in the array and do not have an air gap or a dielectric filled trench in the array. The NAND device is formed by first forming a lower select gate level having separated lower select gates, then forming plural memory device levels containing a plurality of NAND string portions, and then forming an upper select gate level over the memory device levels having separated upper select gates.
Public/Granted literature
- US09331090B2 Compact three dimensional vertical NAND and method of making thereof Public/Granted day:2016-05-03
Information query
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