Invention Application
- Patent Title: RIGID FLEX BOARD MODULE AND THE MANUFACTURING METHOD THEREOF
- Patent Title (中): 刚性柔性板模块及其制造方法
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Application No.: US14093660Application Date: 2013-12-02
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Publication No.: US20150053463A1Publication Date: 2015-02-26
- Inventor: CHI-SHIANG CHEN , HSIU-CHING HU , KUN-WU LI , FANG-PING WU
- Applicant: UNIMICRON TECHNOLOGY CORP.
- Applicant Address: TW Taoyuan Hsien
- Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee: UNIMICRON TECHNOLOGY CORP.
- Current Assignee Address: TW Taoyuan Hsien
- Priority: TW102130435 20130826
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/46
Abstract:
A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.
Public/Granted literature
- US09253898B2 Rigid flex board module and the manufacturing method thereof Public/Granted day:2016-02-02
Information query
