发明申请
- 专利标题: EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
- 专利标题(中): 嵌入式多层陶瓷电子元件及其印刷电路板
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申请号: US14135220申请日: 2013-12-19
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公开(公告)号: US20150053472A1公开(公告)日: 2015-02-26
- 发明人: Jin Woo LEE , Hai Joon LEE , Byoung Hwa LEE , Jin Man JUNG
- 申请人: Samsung Electro-Mechanics Co., Ltd.
- 申请人地址: KR Suwon
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2013-0100976 20130826
- 主分类号: H01G4/005
- IPC分类号: H01G4/005 ; H05K1/18
摘要:
There is provided an embedded multilayer ceramic electronic component including: a ceramic body including a dielectric layer; a plurality of first and second internal electrodes; and first and second external electrodes formed on both end portions of the ceramic body, wherein the first and second external electrodes are extended to first and second main surfaces of the ceramic body, and when a thickness of the ceramic body is defined as ts, a maximum thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body is defined as tb, a minimum distance of the first and second external electrodes formed on first and second end surfaces of the ceramic body in a length direction of the ceramic body is defined as ta, tb/ts and ta/tb satisfy the following Equations, respectively: 0.1≦tb/ts≦1.0 and 0.5≦ta/tb≦2.0.
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