MULTILAYER CERAMIC CAPACITOR
    1.
    发明申请

    公开(公告)号:US20220285099A1

    公开(公告)日:2022-09-08

    申请号:US17752179

    申请日:2022-05-24

    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween; first and second through electrodes penetrating the body, connected to the first and second internal electrodes, respectively, and including nickel; first and second external electrodes, and connected to the first through electrode; and third and fourth external electrodes spaced apart from the first and second external electrodes, and connected to the second through electrode. Each of the first to fourth external electrodes includes a sintered electrode including nickel, and a first plating layer and a second plating layer stacked on the sintered electrode in order.

    MULTILAYER CERAMIC CAPACITOR
    2.
    发明申请

    公开(公告)号:US20220208476A1

    公开(公告)日:2022-06-30

    申请号:US17698415

    申请日:2022-03-18

    Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes disposed with the dielectric layer interposed therebetween and disposed in point-symmetry with each other; first and second connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the first internal electrode; third and fourth connection electrodes penetrating the body in a direction perpendicular to the dielectric layer and connected to the second internal electrode; first and second external electrodes disposed on both surfaces of the body and connected to the first and second connection electrodes; and third and fourth external electrodes spaced apart from the first and second external electrodes and connected to the third and fourth connection electrodes, and the first and second internal electrodes include a region in which an electrode is not disposed.

    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN
    4.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC PART TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC PART EMBEDDED THEREIN 有权
    多层陶瓷电子部件嵌入板和印刷电路板上嵌有多层陶瓷电子部件

    公开(公告)号:US20150021080A1

    公开(公告)日:2015-01-22

    申请号:US14149474

    申请日:2014-01-07

    Abstract: There is provided a multilayer ceramic electronic part to be embedded in a board including: a ceramic body including dielectric layers; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers disposed on and below the active layer, respectively; and first and second external electrodes formed on both end portions of the ceramic body, wherein a first internal electrode positioned at an outermost position among the first electrodes is connected to the first external electrode by at least one first via extended to at least one of first and second main surfaces of the ceramic body, and a second internal electrode positioned at an outermost position among the second internal electrodes is connected to the second external electrode by at least one second via extended to at least one of first and second main surfaces of the ceramic body.

    Abstract translation: 本发明提供一种嵌入板的多层陶瓷电子部件,包括:包含电介质层的陶瓷体; 包括多个第一和第二内部电极的有源层; 分别设置在有源层上和下面的上和下覆盖层; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极,其中,位于所述第一电极中的最外侧位置的第一内部电极通过至少一个第一通孔连接到所述第一外部电极,所述至少一个第一通孔延伸至所述第一外部电极中的至少一个, 所述陶瓷体的第二主表面和位于所述第二内部电极中的最外侧位置的第二内部电极通过至少一个第二通孔延伸至所述第二外部电极的第一和第二主表面中的至少一个, 陶瓷体。

    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME
    5.
    发明申请
    EMBEDDED MULTILAYER CERAMIC ELECTRONIC COMPONENT AND PRINTED CIRCUIT BOARD HAVING THE SAME 审中-公开
    嵌入式多层陶瓷电子元件及其印刷电路板

    公开(公告)号:US20140262463A1

    公开(公告)日:2014-09-18

    申请号:US13941172

    申请日:2013-07-12

    CPC classification number: H05K1/183 H01G2/06 H01G4/005 H01G4/224 H05K1/162

    Abstract: There is provided an embedded multilayer ceramic electronic component including a ceramic body including dielectric layers, having first and second main surfaces, first and second side surfaces, and first and second end surfaces, and having a thickness of 250 μm or less, first and second internal electrodes alternately exposed to the first or second side surface, and first and second external electrodes formed on the first and second side surfaces, wherein the first external electrode includes a first electrode layer and a first metal layer, the second external electrode includes a second electrode layer and a second metal layer, the first and second external electrodes are extended onto the first and second main surfaces, and widths of the first and second external electrodes formed on the first and second main surfaces are different from each other.

    Abstract translation: 提供一种嵌入式多层陶瓷电子部件,其包括具有电介质层的陶瓷体,具有第一和第二主表面,第一和第二侧表面以及第一和第二端面,并且具有250μm或更小的厚度,第一和第二 交替暴露于第一或第二侧表面的内部电极以及形成在第一和第二侧表面上的第一和第二外部电极,其中第一外部电极包括第一电极层和第一金属层,第二外部电极包括第二外部电极 电极层和第二金属层,第一和第二外部电极延伸到第一和第二主表面上,并且形成在第一和第二主表面上的第一和第二外部电极的宽度彼此不同。

    CAPACITOR COMPONENT
    6.
    发明申请
    CAPACITOR COMPONENT 审中-公开

    公开(公告)号:US20200075249A1

    公开(公告)日:2020-03-05

    申请号:US16430950

    申请日:2019-06-04

    Abstract: A capacitor component includes: a body including first and second internal electrodes alternately disposed in a first direction; first and second connection electrodes extending in the first direction in the body, respectively connected to the first and second internal electrodes, and opposing each other in a second direction; and first and second external electrodes disposed on one surface of the body and respectively connected to the first and second connection electrodes and each include an extended pattern disposed at one end portion on the one surface in the second direction and extending in a third direction, and a connection pattern extending, in the second direction, from a region spaced apart from both ends of the extended pattern in the third direction and connected to one of the first and second connection electrodes in a region spaced apart from opposite ends of the extended pattern in the third direction.

    MULTILAYER CERAMIC ELECTRONIC COMPONENT
    7.
    发明申请

    公开(公告)号:US20190326058A1

    公开(公告)日:2019-10-24

    申请号:US16170499

    申请日:2018-10-25

    Abstract: A multilayer ceramic electronic component includes: a ceramic body and first and second external electrodes on external surfaces of the ceramic body. The ceramic body includes first and second internal electrodes facing each other with dielectric layers interposed therebetween. The ceramic body includes an active portion in which capacitance is formed and cover portions on upper and lower surfaces of the active portion, respectively. The ratio of the thickness of the first and second external electrodes to the thickness of the cover portion is proportional to the inverse of the cube root of the ratio of the Young's Modulus of each of the first and second external electrodes to the Young's modulus of the cover portion.

    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
    9.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME 有权
    多层陶瓷电容器和具有该陶瓷电容器的电路板

    公开(公告)号:US20150302992A1

    公开(公告)日:2015-10-22

    申请号:US14335613

    申请日:2014-07-18

    Abstract: There are provided a multilayer ceramic capacitor and a circuit board having the same. The multilayer ceramic capacitor may include: first and second internal electrodes connected to first and second external electrodes, respectively, and disposed to face each other; and third and fourth internal electrodes connected to the first and second external electrodes, respectively, and disposed to face each other, a connection area of the third and fourth internal electrodes with the first and second external electrodes being different from that of the first and second internal electrodes with the first and second external electrodes, and the first and second external electrodes including first and second conductive layers disposed in inner portions thereof and first and second conductive resin layers disposed in outer portions thereof, respectively.

    Abstract translation: 提供了一种多层陶瓷电容器和具有该多层陶瓷电容器的电路板。 多层陶瓷电容器可以包括:第一和第二内部电极,分别连接到第一外部电极和第二外部电极并且彼此面对设置; 以及第三和第四内部电极,分别与第一外部电极和第二外部电极相连并且彼此相对配置,第三和第四内部电极与第一和第二外部电极的连接区域与第一和第二外部电极的连接区域不同于第一和第二外部电极的连接区域 具有第一外部电极和第二外部电极的内部电极,第一外部电极和第二外部电极分别包括设置在其内部的第一和第二导电层以及设置在其外部的第一和第二导电树脂层。

    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN
    10.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD AND PRINTED CIRCUIT BOARD HAVING MULTILAYER CERAMIC ELECTRONIC COMPONENT EMBEDDED THEREIN 有权
    多层陶瓷电子元件嵌入板和印刷电路板上嵌有多层陶瓷电子元件

    公开(公告)号:US20150122535A1

    公开(公告)日:2015-05-07

    申请号:US14171306

    申请日:2014-02-03

    Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board including: a ceramic body including dielectric layers and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; first and second internal electrodes stacked to be spaced apart from both end surfaces of the ceramic body at a predetermined distance with the dielectric layers interposed therebetween, respectively; and first and second external electrodes formed in both end portions of the ceramic body, wherein the first and second external electrodes include first and second base electrodes and first and second terminal electrodes formed on the first and second base electrodes, respectively, and a non-conductive paste layer is formed on both lateral surfaces of the ceramic body.

    Abstract translation: 本发明提供一种嵌入板的多层陶瓷电子部件,包括:陶瓷体,其包括电介质层,并具有彼此相对的第一和第二主表面,彼此相对的第一和第二侧表面以及与其相对的第一和第二端面 另一个; 第一和第二内部电极分别堆叠成与陶瓷体的两个端面间隔开预定的距离,介电层插入其间; 以及形成在所述陶瓷体的两端部的第一外部电极和第二外部电极,其中,所述第一外部电极和所述第二外部电极分别包括形成在所述第一和第二基极上的第一和第二基极以及形成在所述第一和第二基极上的第一和第二端子电极, 导电浆料层形成在陶瓷体的两个侧表面上。

Patent Agency Ranking