Disclosed herein are thermally conductive blended polycarbonate compositions with improved thermal conductivity and mechanical performance properties. The resulting compositions, comprising one or more polycarbonate polymers and one or more thermally conductive fillers, can be used in the manufacture of articles requiring thermally conductive materials with improved mechanical properties such as electronic devices. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention.