发明申请
- 专利标题： METHOD OF CONTROLLING ADHERENCE OF MICROPARTICLES TO SUBSTRATE TO BE PROCESSED, AND PROCESSING APPARATUS
- 专利标题（中）： 控制待处理基板的微处理器的安装方法和处理装置
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申请号： US14387654申请日： 2012-11-07
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公开(公告)号： US20150075566A1公开(公告)日： 2015-03-19
- 发明人: Takehiro Tanikawa , Kazuki Moyama
- 申请人： TOKYO ELECTRON LIMITED
- 申请人地址： JP Tokyo
- 专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人： TOKYO ELECTRON LIMITED
- 当前专利权人地址： JP Tokyo
- 优先权： JP2012-100213 20120425
- 国际申请： PCT/JP2012/078875 WO 20121107
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; H01J37/32
摘要：
A method of controlling adherence of microparticles to a substrate to be processed includes applying voltage to an electrostatic chuck configured to electrostatically attract the substrate to be processed in a processing container before the substrate to be processed is carried into the processing container; and, after the applying of voltage to the electrostatic chuck, carrying the substrate to be processed into the processing container. Further, in the applying of voltage to the electrostatic chuck, the voltage is applied to the electrostatic chuck to reduce a potential difference between a focus ring and the substrate to be processed, the focus ring being provided to surround the electrostatic chuck.
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