发明申请
- 专利标题： METHOD FOR MANUFACTURING ELECTRONIC DEVICE
- 专利标题（中）： 制造电子器件的方法
-
申请号： US14385970申请日： 2012-03-27
-
公开(公告)号： US20150079708A1公开(公告)日： 2015-03-19
- 发明人: Jun Sugahara , Hidetaka Ohazawa , Shinsuke Tanaka , Hiromu Nara , Hiroki Tan
- 申请人： Jun Sugahara , Hidetaka Ohazawa , Shinsuke Tanaka , Hiromu Nara , Hiroki Tan
- 申请人地址： JP Tendo-shi, Yamagata JP Kawasaki-shi, Kanagawa
- 专利权人： TOHOKU PIONEER CORPORATION,PIONEER CORPORATION
- 当前专利权人： TOHOKU PIONEER CORPORATION,PIONEER CORPORATION
- 当前专利权人地址： JP Tendo-shi, Yamagata JP Kawasaki-shi, Kanagawa
- 国际申请： PCT/JP2012/058014 WO 20120327
- 主分类号： H01L51/56
- IPC分类号： H01L51/56 ; B05D1/26 ; C23C16/455
摘要：
When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2.
公开/授权文献
- US09722213B2 Method for manufacturing electronic device 公开/授权日：2017-08-01
信息查询
IPC分类:
