公开(公告)号：US20150079708A1

公开(公告)日：2015-03-19

申请号：US14385970

申请日：2012-03-27

申请人： Jun Sugahara ,  Hidetaka Ohazawa ,  Shinsuke Tanaka ,  Hiromu Nara ,  Hiroki Tan

发明人： Jun Sugahara ,  Hidetaka Ohazawa ,  Shinsuke Tanaka ,  Hiromu Nara ,  Hiroki Tan

IPC分类号： H01L51/56 ,  B05D1/26 ,  C23C16/455

CPC分类号： H01L51/56 ,  B05D1/26 ,  C23C16/45525 ,  H01L23/3171 ,  H01L27/3246 ,  H01L27/3283 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/00

摘要： When a coating film 4 is formed on a substrate 1, on which elements 3 are formed, by an ALD film forming method or the like, the coating film 4 is partially removed in a simple step. A method for manufacturing an electronic device includes a step of coating the substrate 1 partially with a partially coating member 2, a step of forming the elements 3 on the substrate 1, a step of forming the coating film 4 on the substrate 1 to cover the elements 3 and the partially coating member 2, and a step of forming a crack 4A in the coating film 4 on the partially coating member 2.

摘要翻译： 当通过ALD膜形成方法等在形成有元件3的基板1上形成涂膜4时，以简单的步骤部分去除涂膜4。 一种电子器件的制造方法，其特征在于，具备：部分涂敷部件2部分地涂布基板1的工序;在基板1上形成元件3的工序;在基板1上形成涂膜4， 元件3和部分涂覆部件2，以及在部分涂覆部件2上的涂膜4中形成裂纹4A的步骤。