A rolled film formation apparatus including a first chamber in which a first precursor is applied to a substrate, a second chamber in which a second precursor is applied to the substrate such that the first and second precursors react with each other and that an atomic layer is deposited on the substrate, a third chamber in which a purge gas is applied to the substrate, and conveyance roller pairs which are positioned in the first, second and third chambers, and convey the substrate. Each conveyance roller pair includes a first roller and a second roller which sandwich the substrate in a thickness direction of the substrate. At least one of the first and second rollers has an outer peripheral surface having a surface unevenness. The substrate is moved back and forth among the first, second and third chambers. The atomic layer is deposited more than once on the substrate.